Description
Copper produces dense, well bonded coatings with excellent machinability. It is widely used for electrical conductivity and printing roll applications.
Chemical Composition
| Cu | Sn | Mn | Si | P | Others |
| 98 | 0.8 | 0.3 | 0.3 | 0.01 | < 0.5 |
Deposit Characteristic
| Electrical Conductivity | Good |
| Thermal Conductivity | Good |
| Typical Hardness | 40 HRB |
| Bond Strength | 2000 psi |
| Deposit Rate | 10 lbs/hr/100A |
| Deposit Efficiency | 75% |
| Wire Coverage | 0.9 oz/ft2 / mil |
| Surface Texture | Depends on air pressure used |
| Machinability | Good |
Application
- Electrical Conductivity
- Printing Rolls
- Decorative Purposes
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