Description
Tin produces dense, well-bonded coatings particularly applicable for electrical conductivity applications.
Chemical Composition
| Sn |
| 99.9 |
Deposit Characteristic
| Typical Hardness | 65 – 70 HRB |
| Bond Strength | 2500 psi |
| Deposit Rate | 48 lbs/hr/100A |
| Deposit Efficiency | 50% (arc spray) 70% (flame spray) |
| Wire Coverage | 1.0 oz/ft2 / mil (arc spray) 0.8 oz/ft2 / mil (flame spray) |
| Surface Texture | Depends on air pressure used |
| Machinability | Good |
Application
- Solderable surface for electrical components
- EMI/RFI Shielding
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